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AS1113
50mA, 16-Channel LED Driv e r w i t h D i a g n o s t i c s
D a ta S he e t
1 General Description
The AS1113 is designed to drive up to 16 LEDs through a fast serial interface and features 16 output constant current drivers and an on-chip diagnostic read-back function. The high clock-frequency (up to 50MHz), adjustable output current, and flexible serial interface makes the device perfectly suited for high-volume transmission applications. Output current is adjustable (up to 50mA/channel) using an external resistor (REXT). The serial interface with Schmitt trigger inputs includes an integrated shift register. Additionally, an internal data register stores the currently displayed data. The device features integrated diagnostics for overtemperature, open-LED, and shorted-LED conditions. Integrated registers store global fault status information during load as well as the detailed temperature/openLED/shorted-LED diagnostics results. The AS1113 also features a low-current diagnostic mode to minimize display flicker during fault testing. The AS1113 is available in a 24-pin SSOP and the 28pin QFN (5x5mm) package. If a higher output current is needed, please see the AS1110 with 100mA drive capability.
2 Key Features
! !
16 Constant-Current Output Channels Excellent Output Current Accuracy - Between Channels: <3% - Between Devices: <6%
! ! !
Output Current Per Channel: 0.5 to 50mA Controlled In-Rush Current Over-Temperature, Open-LED, Shorted-LED Diagnostic Functions Low-Current Test Mode Global Fault Monitoring Low Shutdown Mode Current: 10A Fast Serial Interface: 50MHz Cascaded Configuration Extremely Fast Output Drivers Suitable for PWM 24-pin SSOP and 28-pin QFN (5x5mm) Package
! ! ! ! ! ! !
3 Applications
The device is ideal for fixed- or slow-rolling displays using static or multiplexed LED matrix and dimming functions, large LED matrix displays, mixed LED display and switch monitoring, displays in elevators, public transports (underground, trains, buses, taxis, airplanes, etc.), large displays in stadiums and public areas, price indicators in retail stores, promotional panels, bar-graph displays, industrial controller displays, white good panels, emergency light indicators, and traffic signs.
Figure 1. Main Diagram and Pin Assignments
OUTN11
OUTN10
OUTN12
OUTN13
OUTN14
+VLED OUTN3 OUTN4 OUTN5 OUTN6 OUTN7 OUTN8 OUTN0 OUTN1 OUTN2 OUTN9
SDI
AS1113
OUTN15 SDO
CLK
LD
OEN
REXT
GND
VDD
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AS1113
Data Sheet
Contents
1 General Description ................................................................................................................................ 1 2 Key Features .......................................................................................................................................... 1 3 Applications ............................................................................................................................................ 1 4 Pinout ..................................................................................................................................................... 3
Pin Assignments ..................................................................................................................................................... 3 Pin Descriptions ..................................................................................................................................................... 3
5 Absolute Maximum Ratings .................................................................................................................... 4 6 Electrical Characteristics ........................................................................................................................ 5
Switching Characteristics ....................................................................................................................................... 6
7 Typical Operating Characteristics ........................................................................................................... 7 8 Detailed Description ............................................................................................................................... 8
Serial Interface ....................................................................................................................................................... 9 Timing Diagrams .................................................................................................................................................... 9 Error-Detection Mode ........................................................................................................................................... 11 Global Error Mode ................................................................................................................................................ 11 Error Detection Functions ..................................................................................................................................... 12 Open-LED Detection ..................................................................................................................................... 12 Shorted-LED ................................................................................................................................................. 12 Overtemperature ........................................................................................................................................... 12 Detailed Error Reports .......................................................................................................................................... 13 Detailed Temperature Warning Report ......................................................................................................... Detailed Open-LED Error Report .................................................................................................................. Detailed Shorted-LED Error Report .............................................................................................................. Low-Current Diagnostic Mode ....................................................................................................................... 13 14 15 15
Shutdown Mode .................................................................................................................................................... 16
9 Application Information ......................................................................................................................... 17
Error Detection ..................................................................................................................................................... 17 Error Detection On-The-Fly ........................................................................................................................... 17 Error Detection with Low-Current Diagnosis Mode ....................................................................................... 17 Cascading Devices ............................................................................................................................................... 18 Constant Current .................................................................................................................................................. 19 Adjusting Output Current ...................................................................................................................................... 19 Package Power Dissipation .................................................................................................................................. 19 Delayed Outputs ................................................................................................................................................... 19 Switching-Noise Reduction .................................................................................................................................. 19 Load Supply Voltage ............................................................................................................................................. 19
10 Package Drawings and Markings ....................................................................................................... 21 11 Ordering Information ........................................................................................................................... 23
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AS1113
Data Sheet - P i n o u t
4 Pinout
Pin Assignments
Figure 2. Pin Assignments (Top View)
REXT GND GND GND GND
VDD
SDI
OUTN15
OUTN14
OUTN13
OUTN12
OUTN10 OUTN5
OUTN11
OUTN9 OUTN6
REXT
28 27 26 25 24 23 22 CLK LD OUTN0 OUTN1 OUTN2 OUTN3 OUTN4 1 2 3 4 5 6 7 8 OUTN5 9 OUTN6 10 11 12 13 14 OUTN10 OUTN8 OUTN7 OUTN9 N/C 21 SDO 20 OEN
24 23 22 21 20 19 18 17 16 15 14 13
AS1113
28-pin QFN 5x5
19 OUTN15 18 OUTN14 17 OUTN13 16 OUTN12 15 OUTN11 1 GND 2 SDI 3 CLK 4 LD 5 OUTN0 6 OUTN1 7 OUTN2 8 OUTN3 9 10 11 12 OUTN4 OUTN7
AS1113
24-pin SSOP
Pin Descriptions
Table 1. Pin Descriptions Pin Number SSOP 1 2 3 4 5:20 QFN 24:27 28 1 2 3:10 12:19 Pin Name GND SDI CLK LD OUTN0:15 Ground Serial Data Input Serial Data Clock. The rising edge of the CLK signal is used to clock data into and out of the AS1113 shift register. In error mode, the rising edge of the CLK signal is used to switch error modes. Serial Data Load Output Current Drivers. These pins are used as LED drivers or for input sense for diagnostic modes. Data is transferred to the data register at the rising edge of these pins. Output Enable. The active-low pin OEN signal can always enable output drivers to sink current independent of the AS1113 mode. 0 = Output drivers are enabled. 1 = Output drivers are disabled. Serial Data Output. In normal mode SDO is latched out 8.5 clock cycles after SDI is latched in. In global error detection mode this pin indicates the occurrence of a global error. 0 = Global error mode returned an error. 1 = No errors. External Resistor Connection. This pin connects through the external resistor (REXT) to GND, to setup the load current. Positive Supply Voltage Not connected Description
21
20
OEN
22
21
SDO
23 24 -
22 23 11
REXT VDD N/C
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OUTN8
SDO
OEN
VDD
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AS1113
Data Sheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 5 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 2. Absolute Maximum Ratings Parameter VDD to GND Input Voltage Output Voltage GND Pin Current Thermal Resistance JA Ambient Temperature Storage Temperature Humidity Electrostatic Discharge Digital Outputs All Other Pins -40 -55 5 Min 0 -0.4 -0.4 Max 7 VDD +0.4 15 1000 88 23 +85 150 86 2000 2000 +100 + -100 (INOM x 0.5) INOM Units V V V mA C/W C/W C C % V mA Non-condensing Norm: MIL 833 E method 3015 on PCB, 24-pin SSOP package on PCB, 28-pin QFN (5x5mm) package Comments
Latch-Up Immunity
EIA/JESD78 The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/JEDEC J-STD-020C "Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices". The lead finish for Pb-free leaded packages is matte tin (100% Sn).
Package Body Temperature
+260
C
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AS1113
Data Sheet - E l e c t r i c a l C h a r a c t e r i s t i c s
6 Electrical Characteristics
VDD = +3.0 to +5.5V, TAMB = -40 to +85C (unless otherwise specified). Table 3. Electrical Characteristics Symbol VDD VDS IOUT IOH IOL VIH Input Voltage VIL IDS(OFF) VOL VOH IAV(LC1) IAV(LC1) IAV(LC2) IAV(LC2) ILC IPD %/VDS %/VDD RIN(UP) RIN(DOWN) VTHL VTHH TOV1 IDD(OFF)0 IDD(OFF)1 IDD(OFF)2 IDD(ON)1 IDD(ON)2 Supply Current On Off Low Level Output Leakage Current Output Voltage SDO OEN = 1, VDS = 15.0V IOL = +1.0mA IOH = -1.0mA VDS = 0.5V, VDD = Const., REXT = 744 IOUT = 25.26mA, VDS 0.5V, VDD = Const., REXT = 744 VDS = 0.6V, VDD > 3.3V, REXT = 372 IOUT = 50.52mA, VDS 0.6V, VDD = Const., REXT = 372 VDS = 0.8V, VDD = 5.0V VDS = 0.8V, VDD = 5.0V, REXT = 372, OUTN0:15 = On VDS within 1.0 and 3.0V VDD within 3.0 and 5.0V OEN LD 250 250 0.25 VDD = 3.0V VDD = 5.0V 1.2 2.0 0.4 VDD 0.4V 25.25 1.5 50.5 1.5 0.6 10 0.1 1 500 500 0.3 1.3 2.2 150 REXT = Open OUTN0:15 = Off REXT = 744 OUTN0:15 = Off REXT = 372 OUTN0:15 = Off REXT = 744 OUTN0:15 = On REXT = 372 OUTN0:15 = On 2.7 4.3 5.4 6.2 10.5 6 8 9 11 15 mA 800 800 0.45 1.4 2.4 3 0.8 20 3 High Level CLK, OEN, LD, SDI Output Current Parameter Supply Voltage Output Voltage OUTN0:15 OUTN0:15 SDO SDO 0.7 x VDD -0.3 Condition Min 3.0 0 0.5 Typ Max 5.5 15.0 50 -1.0 1.0 VDD + 0.3 0.3 x VDD 0.5 0.4 V mA Unit V V
V
A
Device-to-Device Average Output Current from OUTN0 to OUTN15 Current Skew (Between Channels) Device-to-Device Average Output Current from OUTN0 to OUTN15 Current Skew (Between Channels) Low-Current Diagnosis Mode Power Down Supply Current Output Current vs. Output Voltage Regulation Output Current vs. Supply Voltage Regulation Pullup Resistance Pulldown Resistance Error Detection Threshold Voltage Error Detection Threshold Voltage Overtemperature Threshold Flag
mA % mA % mA A %/V %/V k k V V C
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AS1113
Data Sheet - E l e c t r i c a l C h a r a c t e r i s t i c s
Switching Characteristics
VDD = 3.0 to 5.5V, VDS = 0.8V, VIH = VDD, VIL = GND, REXT = 372, VLOAD = 4.0V, RLOAD = 64, CLOAD = 10pF; guaranteed by design. Table 4. Switching Characteristics for VDD = 5V Symbol tP1 tP2 tP3 tP4 tW(CLK) tW(L) tW(OE) tR
* *
Parameter Propagation Delay Time (Without Staggered Output Delay) Propagation Delay Time Pulse Width CLK Rise Time CLK Fall Time Output Rise Time of VOUT (Turn Off) Output Fall Time of VOUT (Turn On) Setup Time for SDI Hold Time for SDI Setup Time for LD Hold Time for LD OEN Time for Error Detection Staggered Output Delay Output Enable Setup Time Global Error Switching Setup Time Global Error Detection Setup Time Propagation Delay Global Error Flag Switching Time Global Error Flag Maximum Clock Frequency (Cascade Operation) Low-Current Test Mode Propagation Delay Time External Resistor Reaction Time External Resistor Reaction Time
Conditions CLK - SDO LD - OUTNn OEN - OUTNn CLK LD OEN (@IOUT < 60mA)
Min
Typ 5 100 100
Max 10 200 200 10
Unit ns ns ns
15 15 200 500 500 100 100 5 5 5 5 2000 20 20 10 10 5 10 30 50 3 0.05 0.5 0.5 5 0.1 1 1 40 200 300
ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns MHz s s s s
tF tOR tOF tSU(D) tH(D) tSU(L) tH(L) tTESTING tSTAG tSU(OE) tGSW(ERROR) tSU(ERROR) tP(I/O) tSW(ERROR) fCLK tP3,ON tP3,OFF tREXT2,1 tREXT2,1
*
Turn ON Turn OFF Change from REXT1 = 372, IOUT1 = 50.52mA to REXT2 = 37.2k, IOUT2 < 1mA Change from REXT1 = 37.2k, IOUT1 = 0.5mA to REXT2 = 372, IOUT2 > 25mA
If multiple AS1113 devices are cascaded and tr or tf is large, it may be critical to achieve the timing required for data transfer between two cascaded LED drivers.
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AS1113
Data Sheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s
7 Typical Operating Characteristics
Figure 3. Output Current vs. REXT, VDD = 5V; VDS = 0.8V, TAMB = 25C
100
Figure 4. Relative Output Current Error vs. VDD, Iout/Iout@VDD=5V - 1, TAMB = 25C
2
Relative Output Current Error (%) .
1.5 1
REXT = 744; VDS = 0.5V
IOUT (mA) .
0.5 0
10
-0.5 -1
REXT = 372; VDS = 0.6V
-1.5 -2 3 3.5 4 4.5 5 5.5
1 100
REXT ()
1000
10000
VDD (V)
Figure 5. Output Current vs. VDS; VDD = 5V, TAMB = 25C
60 50
Figure 6. Output Current vs. VDS; VDD = 5V, TAMB = 25C
60 50
REXT = 376
REXT = 376 REXT = 470 REXT = 627
IOUT (mA) .
IOUT (mA) .
40 30 20 10 0 0 3 6 9
40 30 20 10 0
REXT = 470 REXT = 627
REXT = 940
REXT = 940
12
15
0
0.2
0.4
0.6
0.8
1
1.2
VDS (V)
VDS (V)
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AS1113
Data Sheet - D e t a i l e d D e s c r i p t i o n
8 Detailed Description
The AS1113 is designed to drive up to 16 LEDs through a fast serial interface and 16 constant-current output drivers. Furthermore, the AS1113 provides diagnostics for detecting open- or shorted-LEDs, as well as over-temperature conditions for LED display systems, especially LED traffic sign applications. The AS1113 contains an 16-bit shift register and an 16-bit data register, which convert serial input data into parallel output format. At AS1113 output stages, sixteen regulated current sinks are designed to provide uniform and constant current with excellent matching between ports for driving LEDs within a wide range of forward voltage variations. External output current is adjustable from 0.5 to 50mA using an external resistor for flexibility in controlling the brightness intensity of LEDs. The AS1113 guarantees to endure 15V maximum at the outputs. The serial interface is capable of operating at a minimum of 30 MHz, satisfying the requirements of high-volume data transmission. Using a multiplexed input/output technique, the AS1113 adds additional functionality to pins SDO, LD and OEN. These pins provide highly useful functions (open- and shorted-LED detection, over-temperature detection), thus reducing pin count. Over-temperature detection will work on-the-run, whereas the open- and shorted-LED detection can be used on-the-run or in low-current diagnostic mode (see page 15). Figure 7. Block Diagram
+VLED OUTN10 OUTN12 OUTN13 OUTN14 OUTN15 Global Error Detection OUTN11 OUTN0 OUTN1 OUTN2 OUTN3 OUTN4 OUTN5 OUTN6 OUTN7 OUTN8 OUTN9
REXT Current Generators OEN LD
Temperature Detection
16-Bit Open Detection & Error Register
16-Bit Short Detection & Error Register
AS1113
16-Bit Data Register
Detailed Error Detection
CLK SDI
16-Bit Shift Register Control Logic
SDO
Indicates 16 Bit Path
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AS1113
Data Sheet - D e t a i l e d D e s c r i p t i o n
Serial Interface
Data accesses are made serially via pins SDI and SDO. At each CLK rising edge, the signal present at pin SDI is shifted into the first bit of the internal shift register and the other bits are shifted ahead of the first bit. The MSB is the first bit to be clocked in. In error-detection mode the shift register will latch-in the corresponding error data of temperature-, open-, and short-error register with each falling edge of LD. The 16-bit data register will latch the data of the shift register at each rising edge of LD. This data is then used to drive the current generator output drivers to switch on the corresponding LEDs as OEN goes low.
Timing Diagrams
This section contains timing diagrams referenced in other sections of this data sheet. Figure 8. Normal Mode Timing Diagram
tW(CLK) CLK 50% 50% 50%
tSU(D) SDI 50%
tH(D) 50%
SDO
50% tP1
tW(L) LD 50% tSU(L) 50% tH(L)
OEN
OEN Low = Output Enabled OUTNx High = Output Off OUTNx Low = Output On
OUTNx
50%
tP2
Figure 9. Output Delay Timing Diagram
tW(OE) OEN 50% tP3 90% OUTN0 50% tOF tSTAG OUTN1 50% 10% 50% tP3 90% 10% tOR tSTAG 50% 50%
14XtSTAG OUTN15 50%
14XtSTAG 50%
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AS1113
Data Sheet - D e t a i l e d D e s c r i p t i o n
Figure 10. Data Input Timing Diagram
OEN tSU(L) tSU(OE)
tW(OE)
LD
16 CLK Pulses
tW(L)
CLK tSU(D) SDI0 Data Bit 15 Data Bit 14 Data Bit 13 Data Bit 12 Data Bit Data Bit n 2 Data Bit 1 Data Bit 0 tH(D) SDO0 Old Data Old Data Old Data Old Data Old Data Old Data Old Data Old Data Bit 15 Bit 14 Bit 13 Bit 12 Bit n Bit 2 Bit 1 Bit 0 tP1 Don't Care Don't Care
Figure 11. Data Input Example Timing Diagram
Time CLK SDI LD OEN OUTN0 OUTN1 OUTN2 OUTN3 OUTN4 OUTN5 OUTN6 OUTN7 OUTN8 OUTN9 OUTN10 OUTN11 OUTN12 OUTN13 OUTN14 OUTN15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
D1 D14 D13 D12 D11 D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
Off On Off On Off On Off On Off On Off On Off On Off On Off On Off On Off On Off On Off On Off On Off On Off On
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AS1113
Data Sheet - D e t a i l e d D e s c r i p t i o n
Figure 12. Switching Global Error Mode Timing Diagram
OEN tTESTING tGSW(ERROR) tSU(ERROR) tP(I/O) tP(I/O) tP(I/O) tGSW(ERROR)
LD
CLK
tGSW(ERROR)
SDI
TFLAG(IN)
OFLAG(IN)
SFLAG(IN)
SDO
Don't Care tP4
TFLAG
Don't Care
OFLAG
Don't Care
SFLAG
Acquisition of Error Status
tSW(ERROR)
tSW(ERROR)
Error-Detection Mode
Acquisition of the error status occurs at the rising edge of OEN. Error-detection mode is started on the rising edge of LD when OEN is high. The CLK signal must be low when entering error detection mode. Error detection for open- and shorted-LEDs can only be performed for LEDs that are switched on during test time. To switch between error-detection modes clock pulses are needed (see Table 5). Note: To test all LEDs, a test pattern that turns on all LEDs must be input to the AS1113.
Global Error Mode
Global error mode is entered when error-detection mode is started. Clock pulses during this period are used to select between temperature, open-LED, and shorted-LED tests, as well as low-current diagnostic mode and shutdown mode (see Table 5). In global error mode, an error flag (TFLAG, OFLAG, SFLAG) is delivered to pin SDO if any errors are encountered. Table 5. Global Error Mode Selections Clock Pulses Output Port 0 1 2 3 4 Don't Care Enabled Enabled Don't Care Don't Care Error-Detection Mode Over-Temperature Detection Open-LED Detection Shorted-LED Detection Low-Current Diagnostic Mode Shutdown Mode SDI = 1: Wakeup SDI = 0: Shutdown Global Error Flag/Shutdown Condition TFLAG = SDO = 1: No over-temperature warning. TFLAG = SDO = 0: Over-temperature warning. OFLAG = SDO = 1: No open-LED error. OFLAG = SDO = 0: Open-LED error. SFLAG = SDO = 1: No shorted-LED error. SFLAG = SDO = 0: Shorted-LED error.
Note: For a valid result SDI must be 1 for the first device.
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AS1113
Data Sheet - D e t a i l e d D e s c r i p t i o n
If there are multiple AS1113s in a chain, the error flag will be gated through all devices. To get a valid result at the end of the chain, a logic 1 must be applied to the SDI input of the first device of the chain. If one device produces an error this error will show up after n*tP(I/O) + tSW(ERROR) at pin SDO of the last device in the chain. This means it is not possible to identify which device in the chain produced the error. Therefore, if a global error occurs, the detailed error report can be run to identify which AS1113, or LED produced the error. Note: When no error has occurred, the detailed error report can be skipped, setting LD and subsequently OEN low.
Error Detection Functions
Open-LED Detection
The AS1113 open-LED detection is based on the comparison between VDS and VTHL. The open LED status is aquired at the rising edge of OEN and stored internally. While detecting open-LEDs the output port must be turned on. Open LED detection can be started with 1 clock pulse during error detection mode while the output port is turned on. Note: LEDs which are turned off at test time cannot be tested and will be shown as a logic 1 in the detailed error report. Table 6. Open LED Detection Modes Output Port State On On Effective Output Point Conditions VDS < VTHL VDS > VTHL Detected Open-LED Error Status Code 0 1 Meaning Open Circuit Normal
Shorted-LED
The AS1113 shorted-LED detection is based on the comparison between VDS and VTHH. The shortened LED status is aquired at the rising edge of OEN and stored internally. While detecting shorted-LEDs the output port must be turned on. Shorted-LED detection can be started with 2 clock pulses during error detection mode while the output port is turned on. For valid results, the voltage at OUTN0:OUTN15 must be lower then VTHH under low-current diagnostic mode operating conditions. This can be achieved by reducing the VLED voltage or by adding additional diodes, resistors or LED's. Note: LEDs which are turned off at test time cannot be tested and will be shown as a logic 1 in the detailed error report. Table 7. Shorted LED Detection Modes Output Port State On On Effective Output Point Conditions VDS > VTHH VDS < VTHH Detected Shorted-LED Error Status Code 0 1 Meaning Short Circuit Normal
Overtemperature
Thermal protection for the AS1113 is provided by continuously monitoring the device's core temperature. The overtemperature status is aquired at the rising edge of OEN and stored internally. Table 8. Overtemperature Modes Output Port State Don't Care Don't Care Effective Output Point Conditions Temperature > TOV1 Temperature < TOV1 Detected Overtemperature Status Code 0 1 Meaning Overtemperature Condition Normal
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AS1113
Data Sheet - D e t a i l e d D e s c r i p t i o n
Detailed Error Reports
The detailed error report can be read out after global error mode has been run. At the falling edge of LD, the detailed error report of the selected test is latched into the shift register and can be clocked out with n*16 clock cycles (n is the number of AS1113s in a chain) via pin SDO. At the same time new data can be written into the shift register, which is loaded on the next rising edge of pin LD. This pattern is shown at the output drivers, at the falling edge of OEN.
Detailed Temperature Warning Report
The detailed temperature warning report can be read out immediately after global error mode has been run. SDI must be 1 for the first device. Bit0 of the 16bit data word represents the temperature flag of the chip. Figure 13. Detailed Temperature Warning Report Timing Diagram
Global Flag Readout OEN tGSW(ERROR) LD t(SU)ERROR CLK tP4 tH(L) Detailed Error Report Readout
SDI
DBit15
DBit14 DBit13 DBit12
DBitn
DBit2
DBit1
DBit0
Don't Care Don't Care
New Data Input SDO tP4 For detailed timing information see Timing Diagrams on page 9. TFLAG Undefined Temperature Error Report Output
TBit0
tP1
Detailed Temperature Warning Report Example Consider a case where four AS1113s are cascaded in one chain. The detailed error report lists the temperatures for each device in the chain: IC1:[70] IC2:[85] IC3:[170] IC4:[60] In this case, IC3 is overheated and will generate a global error, and therefore 4*16 clock cycles are needed to write out the detailed temperature warning report, and optionally read in new data. The detailed temperature warning report would look like this: XXXXXXXXXXXXXXX1 XXXXXXXXXXXXXXX1 XXXXXXXXXXXXXXX0 XXXXXXXXXXXXXXX1 The 0 in the detailed temperature warning report indicates that IC3 is the device with the over-temperature condition. Note: In an actual report there are no spaces in the output.
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AS1113
Data Sheet - D e t a i l e d D e s c r i p t i o n
Detailed Open-LED Error Report
The detailed open-LED error report can be read out immediately after global error mode has been run. SDI must be 1 for the first device. Figure 14. Detailed Open-LED Error Report Timing Diagram
Global Flag Readout OEN tTESTING LD tSU(ERROR) tGSW(ERROR) CLK tGSW(ERROR)
Acquisition of Error Status
Detailed Error Report Readout
tH(L)
tP4
tGSW(ERROR)
SDI
tSW(ERROR)
DBit15
DBit14 DBit13 DBit12 DBitn
DBit2
DBit1
DBit0
Don't Care
New Data Input TFlag tP4 OFlag
OBit15 OBit14 OBit13 OBit12 OBitn OBit2 OBit1 OBit0
SDO
Don't Care
Open Error Report Output
tP1
For detailed timing information see Timing Diagrams on page 9.
Detailed Open-LED Error Report Example Consider a case where three AS1113s are cascaded in one chain. A 1 indicates a LED is on, a 0 indicates a LED is off, and an X indicates an open LED. The open-LED test is only applied to LEDs that are turned on. This test is used with a test pattern where all LEDs are on at test time. IC1:[1111111111111111] IC2:[111XX11111111X11] IC3:[1111111111111111] IC2 has three open LEDs switched on due to input. 3*16 clock cycles are needed to write the entire error code out. The detailed error report would look like this: Input Data: 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 LED Status: 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Failure Code: 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1111111111111111 1 1 1 XX1 1 1 1 1 1 1 1 X1 1 1110011111111011 1111111111111111 1111111111111111 1111111111111111
Comparing this report with the input data indicates that IC2 is the device with two open LEDs at position 4 and 5 and one open LED at position 14. For such a test it is recommended to enter low-current diagnostic mode first (see LowCurrent Diagnostic Mode on page 15) to reduce screen flickering. This test can be used also on-the-fly without using an all 1s test pattern (see Figure 18 on page 17). Note: In an actual report there are no spaces in the output. LEDs turned off during test time cannot be tested and will show a logic 1 in the detailed error report.
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AS1113
Data Sheet - D e t a i l e d D e s c r i p t i o n
Detailed Shorted-LED Error Report
The detailed shorted-LED error report can be read out immediately after global error mode has been run (see Global Error Mode on page 11). SDI must be 1 for the first device. Figure 15. Detailed Shorted-LED Error Report Timing Diagram
Global Flag Readout OEN tTESTING LD tSU(ERROR) tGSW(ERROR) CLK tGSW(ERROR)
Acquisition of Error Status
Detailed Error Report Readout
tH(L) tP4 tGSW(ERROR)
SDI
DBit15
DBit14 DBit13 DBit12
DBitn
DBit2
DBit1
DBit0
Don't Care
tSW(ERROR)
New Data Input
SBit15 SBit14 SBit13 SBit12 SBitn SBit2 SBit1 SBit0
SDO
TFLAG OFLAG TFLAG
SFLAG
Don't Care
tP4 For detailed timing information see Timing Diagrams on page 9.
Shorted-LED Error Report Output
tP1
Detailed Shorted-LED Error Report Example Consider a case where three AS1113s are cascaded in one chain. A 1 indicates a LED is on, a 0 indicates a LED is off, and an X indicates a shorted LED. This test is used on-the-fly. IC1:[11111XX111111111] IC2:[1111111111111111] IC3:[X100011111111111] IC1 has two shorted LEDs which are switched on, IC3 has one shorted LED switched off due to input. 3*16 clock cycles are needed to write the entire error code out. The detailed error report would look like this: Input Data: 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 LED Status: 1 1 1 1 1 X X 1 1 1 1 1 1 1 1 1 Failure Code: 1 1 1 1 1 0 0 1 1 1 1 1 1 1 1 1 1111111111111111 1111111111111111 1111111111111111 0100011111111111 X1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1111111111111111
Showing IC1 as the device with two shorted LEDs at position 6 and 7, and IC3 with one shorted LED at position 1. The shorted LED at position 1 of IC3 cannot be detected, since LEDs turned off at test time are not tested and will show a logic "1" at the detailed error report. To test all LEDs this test should be run with an all 1s test pattern. For a test with an all on test pattern, low-current diagnostic mode should be entered first to reduce on-screen flickering. Note: In an actual report there are no spaces in the output. LEDs turned off during test time cannot be tested and will show a logic 1 in the detailed error report.
Low-Current Diagnostic Mode
To run the open- or shorted-LED test, a test pattern must be used that will turn on each LED to be tested. This test pattern will cause a short flicker on the screen while the test is being performed. The low-current diagnostic mode can be initiated prior to running a detailed error report to reduce this on-screen flickering. Note: Normally, displays using such a diagnostic mode require additional cables, resistors, and other components to reduce the current. The AS1113 has this current-reduction capability built-in, thereby minimizing the number of external components required. Low-current diagnostic mode can be initiated via 3 clock pulses during error-detection mode. After the falling edge of LD, a test pattern displaying all 1s can be written to the shift register which will be used for the next error-detection test.
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AS1113
Data Sheet - D e t a i l e d D e s c r i p t i o n
On the next falling edge of OEN, current is reduced to ILC. With the next rising edge of OEN the current will immediately increase to normal levels and the detailed error report can be read out entering error-detection mode. Figure 16. Switching into Low-Current Diagnostic Mode Timing Diagram
Low-Current Diagnosis Mode OEN tTESTING LD tSU(ERROR) Load Internal all 1s Test Pattern (optional) tH(L)
tGSW(ERROR) CLK tGSW(ERROR) tSW(ERROR) SDI
SDO
TFLAG OFLAG SFLAG
Don't Care
Re-entering Error Detection Mode (see Figure 14) (see Figure 15) Normal Operation Current
tP1 For detailed timing information see Timing Diagrams on page 9.
Shutdown Mode
The AS1113 features a shutdown mode which can be entered via 4 clock pulses during error-detection mode. To enable the shutdown mode a 0 must be placed at SDI after the rising edge of the 3rd clock pulse. To disable shutdown mode a 1 must be placed at SDI after the 3rd clock pulse. The shutdown/wakeup information will be latched through if multiple AS1113 devices are in a chain. At the rising edge of the 4th clock pulse the shutdown bit will be read out and the AS1113 will shutdown or wakeup. Note: In shutdown mode the supply current drops down to <10A. Figure 17. Shutdown Mode Timing Diagram
OEN
LD
tSU(ERROR)
CLK
1 = Wakeup SDI 0 = Shutdown
1 = Wakeup SDO TFLAG OFLAG SFLAG 0 = Shutdown tP4 tSU(D)
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AS1113
Data Sheet - A p p l i c a t i o n I n f o r m a t i o n
9 Application Information
Error Detection
The AS1113 features two types of error detection. The error detection can be used on-the-fly, for active LEDs, without any delay, or by entering into low-current diagnosis mode.
Error Detection On-The-Fly
Error detection on-the-fly will output the status of active LEDs during operation. Without choosing an error mode this will output the temperature flag at every input/output cycle. Triggering one clock pulse for open or two clock pulses for short detection during error detection mode outputs the detailed open- or short-error report with the next input/output cycle (see Figure 18). LEDs turned off at test time are not tested and will show a logic "1" at the detailed error report. Figure 18. Normal Operation with Error Detection During Operation - 64 Cascaded AS1113s
Display Data1 Data2 Data3
SDI
Data2 T/O or S Error Code Data0
Data3
Data4
SDO
GEF
Clock for Error Mode 0x/1x/2x
T/O or S Error Code Data1
GEF
Clock for Error Mode 0x/1x/2x
T/O or S Error Code Data2
CLK
1024x Rising Edge of OEN Acquisition of Error Status
1024x Rising Edge of OEN Acquisition of Error Status Falling Edge of LD; Error Register is copied into Shift Register 50mA
1024x
OEN
LD
Falling Edge of LD; Error Register is copied into Shift Register
Current
GEF = Global Error Flag
Error Detection with Low-Current Diagnosis Mode
This unique feature of the AS1113 uses an internal all 1s test pattern for a flicker free diagnosis of all LEDs. This error detection mode can be started at the end of each input cycle (see Figure 19). Figure 19. Low-Current Diagnosis Mode with Internal All 1s Test Pattern - 64 Cascaded AS1113s
Low-Current Diagnosis Mode Display Data0 Data1 Data2
SDI
Data1 T/O or S Error Code Data0
Data2 O or S Error Code from GEF All 1s Test Pattern
Data3
SDO
GEF
3x Clocks Low- Clock for Error Current Mode Mode 1x/2x
GEF
Temperature Error Code
CLK OEN
1024x Rising Edge of OEN Acquisition of Error Status
1024x
1024x
LD
Use Internal All 1s Falling Edge of LD; Error Register is copied into Shift Register Test Pattern 50mA 0.8mA 50mA GEF = Global Error Flag
Current
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AS1113
Data Sheet - A p p l i c a t i o n I n f o r m a t i o n
The last pattern written into the shift register will be saved before starting low-current diagnosis mode and can be displayed immediately after the test has been performed. Low-current diagnostic mode is started with 3 clock pulses during error detection mode. Then OEN should be enabled for 2s for testing. With the rising edge of OEN the LED test is stopped, and while LD is high the desired error mode can be selected with the corresponding clock pulses. After LD and OEN go low again the previously saved pattern can be displayed at the outputs. With the next data input the detailed error code will be clocked out at pin SDO. Note: See Figure 20 for use of an external test pattern. Figure 20. Low-Current Diagnosis Mode with External Test Pattern - 64 Cascaded AS1113s
Low-Current Diagnosis Mode Display Data1 External all 1s Test Pattern T/O or S Error Code Data0 GEF
3x Clocks Low-Current Mode Clock for Error Mode 1x/2x
Data2
SDI
Data2 O or S Error Code from Test Pattern
Data3
SDO
GEF
Temperature Error Code
CLK OEN
1024x
1024x Rising Edge of OEN Acquisition of Error Status Falling Edge of LD; Error Register is copied into Shift Register
1024x
LD
Current
50mA 0.8mA
50mA
GEF = Global Error Flag
Cascading Devices
To cascade multiple AS1113 devices, pin SDO must be connected to pin SDI of the next AS1113 (see Figure 21). At each rising edge of CLK the LSB of the shift register will be written into the shift register SDI of the next AS1113 in the chain. Note: When n*AS1113 devices are in one chain, n*16 clock pulses are needed to latch-in the input data. Figure 21. Cascading AS1113 Devices
SDI SDI
AS1113 #1
SDO
SDI
AS1113 #2
SDO
SDI
AS1113 #n-1
SDO
CLK CLK LD OEN
LD
OEN
CLK
LD
OEN
CLK
LD
OEN
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AS1113
Data Sheet - A p p l i c a t i o n I n f o r m a t i o n
Constant Current
In LED display applications, the AS1113 provides virtually no current variations from channel-to-channel and from AS1113-to-AS1113. This is mostly due to 2 factors:
!
While IOUT 10mA, the maximum current skew is less than 3% between channels and less than 6% between AS1113 devices. In the saturation region, the characteristic curve of the output stage is flat (see Figure 5 on page 7). Thus, the output current can be kept constant regardless of the variations of LED forward voltages (VF).
!
Adjusting Output Current
The AS1113 scales up the reference current (IREF) set by external resistor (REXT) to sink a current (IOUT) at each output port. As shown in Figure 3 on page 7 the output current in the saturation region is extremely flat so that it is possible to define it as target current (IOUT TARGET). IOUT TARGET can be calculated by: VREXT = 1.253V IREF = VREXT/REXT (if the other end of REXT is connected to ground) IOUT TARGET = IREF*15 = (1.253V/REXT)*15 Where: REXT is the resistance of the external resistor connected to pin REXT. VREXT is the voltage on pin REXT. The magnitude of current (as a function of REXT) is around 50.52mA at 372 and 25.26mA at 744. Figure 3 on page 7 shows the relationship curve between the IOUT TARGET of each channel and the corresponding external resistor (REXT). (EQ 1) (EQ 2) (EQ 3)
Package Power Dissipation
The maximum allowable package power dissipation (PD) is determined as: PD(MAX) = (TJ-TAMB)/RTH(J-A) When 16 output channels are turned on simultaneously, the actual package power dissipation is: PD(ACT) = (IDD*VDD) + (IOUT*Duty*VDS*16) Therefore, to keep PD(ACT) PD(MAX), the maximum allowed output current as a function of duty cycle is: IOUT = {[(TJ-TAMB)/RTH(J-A)]-(IDD*VDD)}/VDS/Duty/16 Where: TJ = 150C (EQ 6) (EQ 4) (EQ 5)
Delayed Outputs
The AS1113 has graduated delay circuits between outputs. These delay circuits can be found between OUTNn and constant current block. The fixed delay time is 20 ns (typ) where OUTN0 has no delay, OUTN1 has 20ns delay, OUTN2 has 40ns delay ... OUTN15 has 300ns delay. This delay prevents large inrush currents, which reduce power supply bypass capacitor requirements when the outputs turn on (see Figure 10 on page 10)
Switching-Noise Reduction
LED drivers are frequently used in switch-mode applications which normally exhibit switching noise due to parasitic inductance on the PCB.
Load Supply Voltage
Considering the package power dissipation limits (see EQ 4:6), the AS1113 should be operated within the range of VDS = 0.4 to 1.0V. For example, if VLED is higher than 5V, VDS may be so high that PD(ACT) > PD(MAX) where VDS = VLED - VF. In this case, the lowest possible supply voltage or a voltage reducer (VDROP) should be used. The voltage reducer allows VDS = (VLED -VF) - VDROP. Note: Resistors or zener diodes can be used as a voltage reducer as shown in Figure 22.
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AS1113
Data Sheet - A p p l i c a t i o n I n f o r m a t i o n
Figure 22. Voltage Reducer using Resistor (Left) and Zener Diode (Right)
Voltage Supply Voltage Supply
VLED VF
}
VDROP
VDROP
{
VF VDS
VLED
VDS
AS1113
AS1113
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AS1113
Data Sheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
10 Package Drawings and Markings
The AS1113 is available in a 28-pin QFN (5x5mm) package and a 24-pin SSOP package. Figure 23. 28-pin QFN (5x5mm) Packagee
-A-
D
INDEX AREA (D/2 xE/2) 4
D2 D2/2
-B-
D/2
E/2
NXL
e
E2/2
aaa C 2x
-BSEE DETAIL B 2 1
6 SEE DETAIL B
-A-
aaa C 2x TOP VIEW
N N-1
INDEX AREA (D/2 xE/2)
NXb bbb ddd
5 CA B C
Datum A or B
4
BTM VIEW
L1
ccc C NX 0.08 C
A
A1
Terminal Tip ODD TERMINAL SIDE 5
Symbol A A1 A3 L L1 aaa bbb ccc ddd eee ggg
Min 0.70 0.00 0.45 0.03
Typ 0.75 0.02 0.20 REF 0.55 0.15 0.10 0.10 0.05 0.08 0.10
Max 0.80 0.05 0.65 0.15
Notes 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2
Symbol D BSC E BSC D2 E2 K b e N ND NE
Min
3.00 3.00 0.20 0.18
Typ 5.00 5.00 3.15 3.15 0.25 0.50 28 7 7
A3
e
SIDE VIEW
SEATING PLANE -C-
Max
3.25 3.25 0.30
Notes 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2, 5 1, 2 1, 2, 5 1, 2, 5
Notes:Unilateral coplanarity zone applies to the exposed heat sink slug as well as the terminals. 1. 2. 3. 4. Dimensioning and tolerancing conform to ASME Y14.5M-1994. All dimensions are in millimeters; angles in degrees. N is the total number of terminals. The terminal #1 identifier and terminal numbering convention shall conform to JEDEC 95 SPP-012. Details of terminal #1 identifier are optional but must be located within the zone indicated. The terminal #1 identifier may be either a mold or marked feature. 5. Dimension b applies to metallized terminal and is measured between 0.15 and 0.30mm from terminal tip. If one end of the terminal has the optional radius, the b dimension should not be measured in that radius area. 6. Dimensions ND and NE refer to the number of terminals on each D and E side, respectively.
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E
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AS1113
Data Sheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
Figure 24. 24-pin SSOP Package
Symbol A A1 A2 b C D E E1 e h L
Min Max 1.35 1.75 0.10 0.25 1.37 1.57 0.20 0.30 0.19 0.25 8.55 8.74 5.79 6.20 3.81 3.99 0.635 BSC 0.22 0.49 0.40 1.27 0 8
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AS1113
Data Sheet - O r d e r i n g I n f o r m a t i o n
11 Ordering Information
The device is available as the standard products shown in Table 9. Table 9. Ordering Information Type AS1113-BSSU AS1113-BSST AS1113-BQFR AS1113-BQFT Description 50mA, 16-Channel LED Driver with Diagnostics 50mA, 16-Channel LED Driver with Diagnostics 50mA, 16-Channel LED Driver with Diagnostics 50mA, 16-Channel LED Driver with Diagnostics Delivery Form Tubes Tape and Reel Tray Tape and Reel Package 24-pin SSOP 24-pin SSOP 28-pin QFN (5x5mm) 28-pin QFN (5x5mm)
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AS1113
Data Sheet
Copyrights
Copyright (c) 1997-2007, austriamicrosystems AG, Schloss Premstaetten, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered (R). All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. All products and companies mentioned are trademarks or registered trademarks of their respective companies.
Disclaimer
Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. austriamicrosystems AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or lifesustaining equipment are specifically not recommended without additional processing by austriamicrosystems AG for each application. For shipments of less than 100 parts the manufacturing flow might show deviations from the standard production flow, such as test flow or test location. The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However, austriamicrosystems AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of austriamicrosystems AG rendering of technical or other services.
Contact Information
Headquarters austriamicrosystems AG A-8141 Schloss Premstaetten, Austria Tel: +43 (0) 3136 500 0 Fax: +43 (0) 3136 525 01
For Sales Offices, Distributors and Representatives, please visit: http://www.austriamicrosystems.com/contact
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